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TE Connectivity
TYPICAL APPLICATION BLOCK DIAGRAM
P 1
Reflowable Thermal Protection for
Power Electronics Designs in Rugged Environments
RTP
P TH
Failed powerFET
or other heat source
ARM
Thermal
Coupling
PIN CONFIGURATION & DESCRIPTION PAD LAYOUT RECOMMENDATIONS
Pin Description
Pin
Pin
Number
1
2
3
Name
P 1
P TH
ARM
Pin Function
Power I/O pin
(Main power current path)
Thermally sensitive power I/O pin -
Intended to share protected component heat sink
Electronic arming pin
Pin
Pin Configuration
of
(Bottom View of Device)
in
Pad Pad Dimensions in mm mm
–
(Top (Top View – Through Component)
9.34 9.34
7.70 7.70
4.14 4.14
ARM ARM
P TH P TH
P 1 P 1
1.07 1.07
2.39 2.39
2.26 2.26
0.98 0.98
DEFINITION OF TERMS / DEVICE BLOCK DIAGRAM
Junction
Open Temp
The internal interface which must achieve the “Open Temperature” for the
RTP device to open thermally after arming. This interface (thermal element)
is located directly above the P TH pad.
The device will open when the junction temperature achieves this value.
ARM
R ARM
I ARM
I ARM and R ARM
R PP and I PP
Current and resistance levels measured between the ARM pin and either the
P 1 or P TH pin. These values are relevant only pre device arming.
Current and resistance levels measured between the P 1 and P TH pins.
Thermal
Protection
Device
Element
P TH
I PP
P 1
te.com/RTP-Launch/
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